In the evaluation of sunken flooring, generally only the superficial structure in plain concrete or in asphalt is considered, in neglecting the foundation.
Subsidence, either generalized or differential and fractures are, almost always, a consequence of the inadequacy of the foundation, as the floor slab distributes and re-transmits the loads to the foundation; it is this latter which, not having elastic properties, tends to deform in the course of time, in creating voids immediately below the paving slab. These voids, which can also be caused by ground subsidence, often reach considerable dimensions: even tens of centimetres.
Consolidation of the foundation is therefore the first step in repairing flooring.
The Uretek Floor Lift method acts directly on the foundation in filling the voids and in re-compacting the more superficial layers of earth and finally in lifting the flooring to its original or the desired level.
In some cases it is recommended to complete the job with deep injections in using the Uretek Deep Injections method.
Lifting of 1 mm (stabilization) up to over 30 cm, laser control.
With the Uretek Floor Lift method, it is possible to lift flooring of all types: the flooring of industrial structures, warehouses, supermarkets, housing, airports, roads and railways.
In almost all cases, the application can be carried out without moving machinery or structures bearing on the flooring and this represents a big saving both in time and money.
The Uretek Floor Lift method allows the zone to be treated to be circumscribed in a very precise way and consequently avoids interrupting commercial or industrial activity.
In the case of road paving, the application can be made to one lane at a time in limiting interference with traffic.
Finally, the Uretek Floor Lift method is extremely rapid as compared with traditional solutions.
 Voids in the subfloor cause subsidence, fissures, loss of levelness and breakage of joints. |
 The material is injected through 15-20 mm holes, directly in the points concerned and with laser control. |
 The material expands, seals, compacts and lifts. |
DESCRIPTION OF THE METHOD »